Tech

June 7, 2012

ICECool to crack thermal management barrier, enable breakthrough electronics

The continued miniaturization and the increased density of components in today’s electronics have pushed heat generation and power dissipation to unprecedented levels.

Current thermal management solutions, usually involving remote cooling, are unable to limit the temperature rise of today’s complex electronic components.

Such remote cooling solutions, where heat must be conducted away from components before rejection to the air, add considerable weight and volume to electronic systems. The result is complex military systems that continue to grow in size and weight due to the inefficiencies of existing thermal management hardware.

Recent advances of the DARPA Thermal Management Technologies program enable a paradigm shift-better thermal management. DARPA’s Intrachip/Interchip Enhanced Cooling (ICECool) program seeks to crack the thermal management barrier and overcome the limitations of remote cooling. ICECool will explore ‘embedded’ thermal management by bringing microfluidic cooling inside the substrate, chip or package by including thermal management in the earliest stages of electronics design.

“Think of current electronics thermal management methods as the cooling system in your car,” said Avram Bar-Cohen, DARPA program manager. “Water is pumped directly through the engine block and carries the absorbed heat through hoses back to the radiator to be cooled. By analogy, ICECool seeks technologies that would put the cooling fluid directly into the electronic ‘engine’. In DARPA’s case this embedded cooling comes in the form of microchannels designed and built directly into chips, substrates and/or packages as well as research into the thermal and fluid flow characteristics of such systems at both small and large scales.”

The ICECool Fundamentals solicitation released today seeks proposals to research and demonstrate the microfabrication and evaporative cooling techniques needed to implement embedded cooling. Proposals are sought for intrachip/interchip solutions that bring microchannels, micropores, etc. into the design and fabrication of chips. Interchip solutions for chip stacks are also sought.

“Thermal management is key for advancing Defense electronics,” said Thomas Lee, director, Microsystems Technology Office. “Embedded cooling may allow for smaller electronics, enabling a more mobile, versatile force. Reduced thermal resistance would improve performance of DOD electronics and may result in breakthrough capabilities we cannot yet envision.”




All of this week's top headlines to your email every Friday.


 
 

 
darpa-notice

DARPA Tactical Technology Office invites innovative risk-takers to attend 2014 Office-Wide Proposers Day

DARPAs Tactical Technology Office invests in innovative platforms, weapons, integrated systems and critical systems components that often incorporate emerging advanced technologies, all designed to preserve and extend decisive ...
 
 

AFRL provides environmentally-preferred alternatives for removing radome coatings

Radomes, tail cones, and other fiberglass or composite components on E-3, KC-135, and B-52 aircraft are coated with polyurethane rain erosion resistant coatings to protect them from the effects of rain erosion in flight. Oklahoma City Air Logistics Complex (OC-ALC) production workers must remove the coatings during depot overhaul to allow for inspection and repair....
 
 
darpa-uav-network

Remote troops closer to having high-speed wireless networks mounted on UAVs

Missions in remote, forward operating locations often suffer from a lack of connectivity to tactical operation centers and access to valuable intelligence, surveillance, and reconnaissance data. The assets needed for long-range...
 

 
Photograph courtesy of Research Center for Marine Geosciences/DLR

NASA signs agreement with German, Canadian partners to test alternative fuels

NASA photograph A heavily instrumented NASA HU-25 Falcon measures chemical components from the larger DC-8′s exhaust generated by a 50/50 mix of conventional jet fuel and a plant-derived biofuel, demonstrating the type of...
 
 
darpa-phoenix2

Phoenix makes strides in orbital robotics, satellite architecture research

The process of designing, developing, building and deploying satellites is long and expensive. Satellites today cannot follow the terrestrial paradigm of “assemble, repair, upgrade, reuse,” and must be designed to operate w...
 
 

AFRL researchers uncover structural, function relationships in bioinspired nanomaterials

In his 1954 work, The Nature of Science, Edwin Powell Hubble said, “Equipped with his five senses, man explores the universe around him and calls the adventure Science.” During his tenure with the Air Force Research Laboratory, National Research Council associate Dr. Nick Bedford, embarked on such an adventure that applied both biological and physical...
 




0 Comments


Be the first to comment!


Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>