Tech

June 7, 2012

ICECool to crack thermal management barrier, enable breakthrough electronics

The continued miniaturization and the increased density of components in today’s electronics have pushed heat generation and power dissipation to unprecedented levels.

Current thermal management solutions, usually involving remote cooling, are unable to limit the temperature rise of today’s complex electronic components.

Such remote cooling solutions, where heat must be conducted away from components before rejection to the air, add considerable weight and volume to electronic systems. The result is complex military systems that continue to grow in size and weight due to the inefficiencies of existing thermal management hardware.

Recent advances of the DARPA Thermal Management Technologies program enable a paradigm shift-better thermal management. DARPA’s Intrachip/Interchip Enhanced Cooling (ICECool) program seeks to crack the thermal management barrier and overcome the limitations of remote cooling. ICECool will explore ’embedded’ thermal management by bringing microfluidic cooling inside the substrate, chip or package by including thermal management in the earliest stages of electronics design.

“Think of current electronics thermal management methods as the cooling system in your car,” said Avram Bar-Cohen, DARPA program manager. “Water is pumped directly through the engine block and carries the absorbed heat through hoses back to the radiator to be cooled. By analogy, ICECool seeks technologies that would put the cooling fluid directly into the electronic ‘engine’. In DARPA’s case this embedded cooling comes in the form of microchannels designed and built directly into chips, substrates and/or packages as well as research into the thermal and fluid flow characteristics of such systems at both small and large scales.”

The ICECool Fundamentals solicitation released today seeks proposals to research and demonstrate the microfabrication and evaporative cooling techniques needed to implement embedded cooling. Proposals are sought for intrachip/interchip solutions that bring microchannels, micropores, etc. into the design and fabrication of chips. Interchip solutions for chip stacks are also sought.

“Thermal management is key for advancing Defense electronics,” said Thomas Lee, director, Microsystems Technology Office. “Embedded cooling may allow for smaller electronics, enabling a more mobile, versatile force. Reduced thermal resistance would improve performance of DOD electronics and may result in breakthrough capabilities we cannot yet envision.”




All of this week's top headlines to your email every Friday.


 
 

 

Headlines September 3, 2015

News Carter To China: US ‘Will Fly, Sail, Operate Wherever Law Allows’ Defense Secretary Ash Carter, in a speech billed as all about a new personnel approach for the Pentagon, laid out a clear line in the sand of the temporary islands the Chinese have been building. http://breakingdefense.com/2015/09/carter-to-china-us-will-fly-sail-operate-wherever-law-allows/ LRS-B details emerge: Major t...
 
 

News Briefs September 3, 2015

Soldier injured after parachute failed to deploy A soldier was injured during a U.S. Army Special Operations parachute training exercise in western Montana. Army officials at Fort Bragg, N.C., say 16 soldiers were conducting a free-fall parachute jump from two Blackhawk helicopters near Hamilton Aug. 31 when one soldier had an equipment malfunction and was...
 
 

Boeing, Jet2.com finalize order for 27 Next Generation 737-800s

Boeing and UK Leisure Airline Jet2.com have finalized an order for 27 Next Generation 737-800s, valued at approximately $2.6 billion at current list prices. Jet2.com currently operates an all-Boeing fleet of nearly 60 aircraft; however, this is the organization’s first direct Boeing order.† The aircraft will be used to take the company’s package holiday and...
 

 
boeing-emirates

Boeing, Emirates celebrate airline’s 150th 777 delivery

Boeing and Emirates Airline Sept. 3 celebrated the simultaneous delivery of three 777s — two 777-300ERs and one 777 Freighter — marking the entry of the 150th 777 into Emirates’ fleet. The delivery marks the first tim...
 
 

U.S. Air Force selects Chromalloy for F108 gas turbine engine module repairs

Chromalloy announced Sept. 2 that it has been selected by the U.S. Air Force to provide repairs on low pressure turbine modules for the F108 aircraft engine fleet, in a contract valued at up to $74 million. The one-year agreement was contracted by the Tinker Air Force Base in Oklahoma and includes four one-year options...
 
 
raytheon-colorado

Raytheon expanding in Colorado Springs

Raytheon will speed up growth of its Colorado Springs presence after signing a $700 million multi-year indefinite-delivery/indefinite-quantity contract to support operations at NORAD’s Cheyenne Mountain Complex. Under the...
 




0 Comments


Be the first to comment!


Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>