Tech

June 7, 2012

ICECool to crack thermal management barrier, enable breakthrough electronics

The continued miniaturization and the increased density of components in today’s electronics have pushed heat generation and power dissipation to unprecedented levels.

Current thermal management solutions, usually involving remote cooling, are unable to limit the temperature rise of today’s complex electronic components.

Such remote cooling solutions, where heat must be conducted away from components before rejection to the air, add considerable weight and volume to electronic systems. The result is complex military systems that continue to grow in size and weight due to the inefficiencies of existing thermal management hardware.

Recent advances of the DARPA Thermal Management Technologies program enable a paradigm shift-better thermal management. DARPA’s Intrachip/Interchip Enhanced Cooling (ICECool) program seeks to crack the thermal management barrier and overcome the limitations of remote cooling. ICECool will explore ‘embedded’ thermal management by bringing microfluidic cooling inside the substrate, chip or package by including thermal management in the earliest stages of electronics design.

“Think of current electronics thermal management methods as the cooling system in your car,” said Avram Bar-Cohen, DARPA program manager. “Water is pumped directly through the engine block and carries the absorbed heat through hoses back to the radiator to be cooled. By analogy, ICECool seeks technologies that would put the cooling fluid directly into the electronic ‘engine’. In DARPA’s case this embedded cooling comes in the form of microchannels designed and built directly into chips, substrates and/or packages as well as research into the thermal and fluid flow characteristics of such systems at both small and large scales.”

The ICECool Fundamentals solicitation released today seeks proposals to research and demonstrate the microfabrication and evaporative cooling techniques needed to implement embedded cooling. Proposals are sought for intrachip/interchip solutions that bring microchannels, micropores, etc. into the design and fabrication of chips. Interchip solutions for chip stacks are also sought.

“Thermal management is key for advancing Defense electronics,” said Thomas Lee, director, Microsystems Technology Office. “Embedded cooling may allow for smaller electronics, enabling a more mobile, versatile force. Reduced thermal resistance would improve performance of DOD electronics and may result in breakthrough capabilities we cannot yet envision.”




All of this week's top headlines to your email every Friday.


 
 

 

Headlines January 23, 2015

News: Yemen chaos threatens U.S. counterterror efforts, including drone programĀ - The White House’s strategy for fighting al-Qaeda in Yemen – repeatedly presented as a model by President Obama – was left in tatters Thursday by the resignation of the man who personally approved U.S. drone strikes in the country and the collapse of its central...
 
 

News Briefs January 23, 2015

NATO detects key Russian military equipment in east Ukraine NATO’s top commander in Europe says the alliance has detected the presence of key Russian military equipment in eastern Ukraine that, in the past, has accompanied large inflows of Russian troops. Gen. Philip Breedlove told a news conference Jan. 22 in Brussels that Russian electronic warfare...
 
 
Boeing photograph

Boeing Maritime Surveillance Aircraft ready for demonstration flights

Boeing photograph The Boeing Maritime Surveillance Aircraft program is ready for customer demonstration flights, having completed the baseline ground and flight testing of the aircraft mission systems. The Boeing Maritime Surve...
 

 
Air Force photograph by Jacqueline Cowan

F135 test demonstrates success of AEDC workshare initiative

Air Force photograph by Jacqueline Cowan Aerospace Testing Alliance Test Engineer Darren Carroll, pictured in front, assists as Pratt & Whitney Test Engineer Ronnie Thomas does a borescope inspection of the fan on the F135 ...
 
 
U.S. Air Force photo by Master Sgt. Kevin J. Gruenwald

40 years of Red Flag at Nellis

U.S. Air Force photo by Master Sgt. Kevin J. Gruenwald A flight of F-15 Eagles and F-16 Fighting Falcons Aggressors fly in formation over the Nevada Test and Training Ranges June 5, 2008. The proposal for Red Flag came in early...
 
 
Lockheed Martin photograph

Navy gears up to order production of 29 aircraft diagnostic systems

Lockheed Martin photograph Petty Officers Third Class Ira Schwartz assigned to Fleet Readiness Center Southeast at Naval Air Station Jacksonville, Fla., left, and Devin Riley from Fleet Readiness Center Mid-Atlantic at Naval Ai...
 




0 Comments


Be the first to comment!


Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>