Tech

October 26, 2012

Lockheed Martin ATC develops revolutionary nanotechnology copper solder

Scientists in the Advanced Materials and Nanosystems directorate at the Lockheed Martin Space Systems Advanced Technology Center in Palo Alto, Calif., have developed a revolutionary nanotechnology copper-based electrical interconnect material, or solder, that can be processed around 200 degrees Celsius.

Once fully optimized, the CuantumFuse(tm) solder material is expected to produce joints with up to 10 times the electrical and thermal conductivity compared to tin-based materials currently in use. Applications in military and commercial systems are currently under consideration.

“We are enormously excited about our CuantumFuse(tm) breakthrough, and are very pleased with the progress we’re making to bring it to full maturity,” said Dr. Kenneth Washington, vice president of the ATC. “We pride ourselves on providing innovations like CuantumFuse(tm) for space and defense applications, but in this case we are excited about the enormous potential of CuantumFuse(tm) in defense and commercial manufacturing applications.”

In the past, nearly all solders contained lead, but there is now an urgent need for lead-free solder because of a worldwide effort to phase out hazardous materials in electronics. The European Union implemented lead-free solder in 2006. The State of California did so on Jan. 1, 2007, followed soon thereafter by New Jersey and New York City.

The principal lead-free replacement – a combination of tin, silver and copper (Sn/Ag/Cu) – has proven acceptable to the consumer electronics industry that deals mostly with short product life cycles and relatively benign operating environments. However, multiple issues have arisen: high processing temperatures drive higher cost, the high tin content can lead to tin whiskers that can cause short circuits, and fractures are common in challenging environments, making it difficult to quantify reliability. These reliability concerns are particularly acute in systems for the military, aerospace, medical, oil and gas, and automotive industries. In such applications, long service life and robustness of components are critical, where vibration, shock, thermal cycling, humidity, and extreme temperature use can be common.

“To address these concerns, we realized a fundamentally new approach was needed to solve the lead-free solder challenge,” said Dr. Alfred Zinn, materials scientist at the ATC and inventor of CuantumFuse(tm) solder. “Rather than finding another multi-component alloy, our team devised a solution based on the well-known melting point depression of materials in nanoparticle form. Given this nanoscale phenomenon, we’ve produced a solder paste based on pure copper.”

A number of requirements were addressed in the development of the CuantumFuse(tm) solder paste including, but not limited to: 1) sufficiently small nanoparticle size, 2) a reasonable size distribution, 3) reaction scalability, 4) low cost synthesis, 5) oxidation and growth resistance at ambient conditions, and 6) robust particle fusion when subjected to elevated temperature. Copper was chosen because it is already used throughout the electronics industry as a trace, interconnect, and pad material, minimizing compatibility issues. It is cheap (1/4th the cost of tin; 1/100th the cost of silver, and 1/10,000th that of gold), abundant, and has 10 times the electrical and thermal conductivity compared to commercial tin-based solder.

The ATC has demonstrated CuantumFuse(tm) with the assembly of a small test camera board. “These accomplishments are extremely exciting and promising, but we still have to solve a number of technical challenges before CuantumFuse(tm) will be ready for routine use in military and commercial applications,” said Mike Beck, director of the Advanced Materials and Nanosystems group at the ATC. Solving these challenges, such as improving bond strength, is the focus on the group’s ongoing research and development.

The ATC is the research and development organization of Lockheed Martin Space Systems Company and is engaged in the research, development, and transition of technologies in phenomenology & sensors, optics & electro-optics, laser radar, RF & photonics, guidance & navigation, space science & instrumentation, advanced materials & nanosystems, thermal sciences & cryogenics, and modeling, simulation & information science.

 




All of this week's top headlines to your email every Friday.


 
 

 

Headlines August 22, 2014

News: GAO: Pentagon violated law with Bergdahl swap - Congressional investigators say the Pentagon violated the law when it swapped five Taliban leaders for Army Sgt. Bowe Bergdahl, who was held prisoner in Afghanistan for five years.   Business: U.S. Air Force issues RFI for new rocket engine - The US Air Force is officially looking into...
 
 

News Briefs August 22, 2014

U.S. military deaths in Afghanistan at 2,200 As of Aug. 20, 2014, at least 2,200 members of the U.S. military had died in Afghanistan as a result of the U.S.-led invasion of Afghanistan in late 2001, according to an Associated Press count. At least 1,821 military service members have died in Afghanistan as a result...
 
 
navair-triton

MQ-4C Tritons to arrive at Pax River this fall

  MQ-4C Triton test air vehicles at Northrop Grumman’s facility in Palmdale, Calif., will fly cross-country to Naval Air Station Patuxent River, Md., this fall. The MQ-4C completed a test flight Aug. 19 with updated ...
 

 
Boeing photograph

Boeing program completes critical design, safety reviews

Boeing photograph Boeing recently completed the Phase Two Spacecraft Safety Review of its Crew Space Transportation-100 spacecraft and the Critical Design Review of its integrated systems, meeting all of the companyís Commerci...
 
 
global-hawk2

Air Combat Command loans Global Hawk to GVCTF

Air Force photograph by Jennifer Romo The 412th Test Wing’s Global Vigilance Combined Test Force received a Global Hawk Block 40 Aug. 6, on loan from Air Combat Command. Tail number 2035, from Grand Forks AFB, N.D., is jo...
 
 

NASA awards program analysis, Control Bridge III Contract

NASA has awarded the Program Analysis and Control III Bridge contract for support services to ASRC Research & Technology Solutions of Beltsville, Md. The cost-plus-fixed-fee, indefinite delivery/indefinite quantity basic contract has a minimum ordering value of $1 million and a maximum ordering value of $37 million, with a performance period beginning Aug. 30 through Feb....
 




One Comment


  1. [...] Link to Article Like this:LikeBe the first to like this. This entry was posted in Uncategorized and tagged Nanotechnology, USA. Bookmark the permalink. ← DoD doubles down on cyber threat reality [...]



Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>