Tech

October 26, 2012

Lockheed Martin ATC develops revolutionary nanotechnology copper solder

Scientists in the Advanced Materials and Nanosystems directorate at the Lockheed Martin Space Systems Advanced Technology Center in Palo Alto, Calif., have developed a revolutionary nanotechnology copper-based electrical interconnect material, or solder, that can be processed around 200 degrees Celsius.

Once fully optimized, the CuantumFuse(tm) solder material is expected to produce joints with up to 10 times the electrical and thermal conductivity compared to tin-based materials currently in use. Applications in military and commercial systems are currently under consideration.

“We are enormously excited about our CuantumFuse(tm) breakthrough, and are very pleased with the progress we’re making to bring it to full maturity,” said Dr. Kenneth Washington, vice president of the ATC. “We pride ourselves on providing innovations like CuantumFuse(tm) for space and defense applications, but in this case we are excited about the enormous potential of CuantumFuse(tm) in defense and commercial manufacturing applications.”

In the past, nearly all solders contained lead, but there is now an urgent need for lead-free solder because of a worldwide effort to phase out hazardous materials in electronics. The European Union implemented lead-free solder in 2006. The State of California did so on Jan. 1, 2007, followed soon thereafter by New Jersey and New York City.

The principal lead-free replacement – a combination of tin, silver and copper (Sn/Ag/Cu) – has proven acceptable to the consumer electronics industry that deals mostly with short product life cycles and relatively benign operating environments. However, multiple issues have arisen: high processing temperatures drive higher cost, the high tin content can lead to tin whiskers that can cause short circuits, and fractures are common in challenging environments, making it difficult to quantify reliability. These reliability concerns are particularly acute in systems for the military, aerospace, medical, oil and gas, and automotive industries. In such applications, long service life and robustness of components are critical, where vibration, shock, thermal cycling, humidity, and extreme temperature use can be common.

“To address these concerns, we realized a fundamentally new approach was needed to solve the lead-free solder challenge,” said Dr. Alfred Zinn, materials scientist at the ATC and inventor of CuantumFuse(tm) solder. “Rather than finding another multi-component alloy, our team devised a solution based on the well-known melting point depression of materials in nanoparticle form. Given this nanoscale phenomenon, we’ve produced a solder paste based on pure copper.”

A number of requirements were addressed in the development of the CuantumFuse(tm) solder paste including, but not limited to: 1) sufficiently small nanoparticle size, 2) a reasonable size distribution, 3) reaction scalability, 4) low cost synthesis, 5) oxidation and growth resistance at ambient conditions, and 6) robust particle fusion when subjected to elevated temperature. Copper was chosen because it is already used throughout the electronics industry as a trace, interconnect, and pad material, minimizing compatibility issues. It is cheap (1/4th the cost of tin; 1/100th the cost of silver, and 1/10,000th that of gold), abundant, and has 10 times the electrical and thermal conductivity compared to commercial tin-based solder.

The ATC has demonstrated CuantumFuse(tm) with the assembly of a small test camera board. “These accomplishments are extremely exciting and promising, but we still have to solve a number of technical challenges before CuantumFuse(tm) will be ready for routine use in military and commercial applications,” said Mike Beck, director of the Advanced Materials and Nanosystems group at the ATC. Solving these challenges, such as improving bond strength, is the focus on the group’s ongoing research and development.

The ATC is the research and development organization of Lockheed Martin Space Systems Company and is engaged in the research, development, and transition of technologies in phenomenology & sensors, optics & electro-optics, laser radar, RF & photonics, guidance & navigation, space science & instrumentation, advanced materials & nanosystems, thermal sciences & cryogenics, and modeling, simulation & information science.

 




All of this week's top headlines to your email every Friday.


 
 

 

Headlines July 23, 2014

News: Israel’s Iron Dome defense in line for tripled U.S. spending - Israel’s iron Dome missile defense system may end up getting triple the U.S. funding that the Defense Department sought for it in March. Ukraine asked U.S. for systems to counter Russian missiles - A month before the United States says a Russian missile likely brought...
 
 

News Briefs July 23, 2014

U.S. military deaths in Afghanistan at 2,194 As of July 22, 2014, at least 2,194 members of the U.S. military had died in Afghanistan as a result of the U.S.-led invasion of Afghanistan in late 2001, according to an Associated Press count. The AP count is three less than the Defense Department’s tally. At least...
 
 
Raytheon photograph

Raytheon completes key Air, Missile Defense Radar reviews

Raytheon photograph Partially-populated, full-sized Air and Missile Defense Radar array. Raytheon has completed two critical program reviews for the new Air and Missile Defense Radar, the U.S. Navy’s next generation integ...
 

 
Insitu photograph

Insitu demonstrates long endurance capabilities of Integrator unmanned aircraft

Insitu photograph Insitu’s Integrator unmanned aircraft recovers via SkyHook; the aircraft recently completed a 24-hour endurance flight. Insitu announced July 22 the successful 24-hour flight of its Integrator unmanned a...
 
 

NASA partners punctuate summer with spacecraft development advances

Spacecraft and rocket development is on pace this summer for NASA’s aerospace industry partners for the agency’s Commercial Crew Program as they progress through systems testing, review boards and quarterly sessions under their† Space Act Agreements with the agency. NASA engineers and specialists continue their review of the progress as the agency and partners move...
 
 

U.S. Navy selects Northrop Grumman for ship self-defense system

The U.S. Navy has awarded Northrop Grumman a $12 million task order for a full range of engineering services to continue modernizing the Ship Self-Defense System Mark 2. The contract has a potential value of $61 million over five years, if all options are exercised. SSDS MK2 is a combat system designed for anti-air defense...
 




One Comment


  1. [...] Link to Article Like this:LikeBe the first to like this. This entry was posted in Uncategorized and tagged Nanotechnology, USA. Bookmark the permalink. ← DoD doubles down on cyber threat reality [...]



Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>