Lockheed Martin ATC develops revolutionary nanotechnology copper solder
Scientists in the Advanced Materials and Nanosystems directorate at the Lockheed Martin Space Systems Advanced Technology Center in Palo Alto, Calif., have developed a revolutionary nanotechnology copper-based electrical interconnect material, or solder, that can be processed around 200 degrees Celsius. Once fully optimized, the CuantumFuse(tm) solder material is expected to produce joints with up to…
